Ceramic Small Outline Packages
Lead count cavity overall layer t hic kness total 0084 0085 0085 0085 lead nt k mat erial code ring connection drawing no o non co ne ct attach.
Ceramic small outline packages. Ceramic small outline packages offer a readily available surface mount alternative to plastic surface packages. Ceramic small outline package csop national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications. Csop ceramic small outline packages mm inch unit. Up u down d 1st 2nd 3rd total pitch stand off height seal ring.
Ceramic substrates for probe cards. Material in laminated ceramic packages. Copper cu a copper alloy a copper nickel tin alloy is used as the lead frame material in plastic packages. Also used as a structural material in ceramic.
Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Standard packages and lids for device evaluation. Small outline package straight lead small outline l leaded package 1 27. Mm lead count cavity overall layer thickness lead ntk material code b black w white connection 0 non conect drawing no.