Ceramic Substrates Amp

Our precision etching technology pushes thick film ceramic substrates to a best in class position offering the tightest tolerances and the highest performances rivaling thin film capabilities.

Ceramic substrates amp. Modern electronics are based on the integrated circuit an assembly of millions of interconnected components such as transistors. Ceramtec s own metalized substrates are optimally suited for directly mounting electronic components onto ceramic. 972 393 6888 fax 972 393 6889. If it s possible in thin film chances are it can be realized in etched thick film at a fraction of the price.

Our engineers have an international reputation for machining to a very high degree of accuracy. Atp fabricates circuits on substrates using as fired alumina polished alumina aluminum nitride beryllium oxide fused silica quartz sapphire and hi k dielectrics. Ceramtec develops the metalization pastes itself and these pastes are characterized by their high bond strength good solder flow and. In sizes larger than 6 od metallic substrates are competitive with ceramic and sizes larger than 10 metallic s have a lower cost.

Info ceramic substrates co uk company registration no 934853. Ceramtec metalizes these substrates manufactured for use in electronic circuits in house. 44 0 1983 822252 email. 44 0 1983 528697 fax.

A 210 90 mm 2 rectangular shaped ceramic plate of 90 wt in 2 o 3 and 10 wt sno 2 purity 99 99 was used as target. 510 661 4287 applied thin film products atp offers build to print services for a wide range of materials and metalization schemes. Both substrates and target were separately presputtered in pure ar atmosphere respectively for 25 minutes at 5 pa and for 10 minutes at 1 pa. World headquarters 1122 w bethel rd 400 75019 coppell tx usa.

The target to substrate distance was kept constant at 80 mm. At ceramic substrates we operate with a bank of nine cnc s twelve traditional lathes and mills producing fully engineered machinable ceramic components six days a week. Website usage terms and conditions. Metallized ceramic substrates have a structure in which metal plates are bonded to both sides of the insulating ceramic substrate as discussed in section 3 1.